The Semiconductor Industry Association (SIA), the top trade association representing the U.S. semiconductor industry, has signed a Memorandum of Understanding (MoU) with the India Electronics and Semiconductor Association (IESA), the premier trade group representing India’s semiconductor and electronics systems design and manufacturing industry, to foster collaboration and identify potential opportunities between the two countries in the semiconductor sector.
Headquartered in Washington D.C., SIA represents 99 per cent of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms, while IESA is the premier Indian trade body committed to the development of a vibrant Indian semiconductor and Electronics System Design and Manufacturing (ESDM) ecosystem and promoting Brand India.
Under the MoU, both associations will assist each other as the main counterpart organization on semiconductor-related matters within India and the United States and will co-organize meetings between member companies to promote cooperation on issues of mutual interest.
Both organizations will also co-organize joint events (virtual or in-person) to explore potential opportunities for U.S.-India cooperation within the global semiconductor value-chain.
Commenting on the MoU, John Neuffer, President and CEO of SIA, said, “We are delighted to sign this MoU with IESA and welcome India’s goal to become both a more powerful digital economy and a hub for electronics and semiconductor innovation within the broader global value chain. This MoU will help SIA establish and build relationships with key stakeholders and, for our members, gain a better understanding of the market in India.”
“We look forward to India working towards an even more competitive policy environment and intellectual property regime fortified with transparency and predictability that promotes trade policies designed to help this great economy more deeply integrate with the global value chains in our sector,” added Neuffer.
